Packaging part 7 - System in Package


Summary

The video delves into the origin and advancements of System and Package (SAP) technology, emphasizing the integration of active and passive devices for enhanced performance and miniaturization. It explores how SAP boosts chip integration and performance through features like flip chips and digital RF integration, with applications across various industries and emerging trends in 2.5D and 3D integration. The discussion on security risks underscores the importance of protective measures like firewalls, while also addressing challenges like yield and design complexities alongside benefits such as high-frequency support and small form factors in SAP technology. The evolution of SAP from chip integration to chiplets and its current state as a system with integrated memory and logic are also highlighted.


Introduction to System and Package (SAP)

Discussion on the origin and early developments of System and Package (SAP) technology, including the integration of active and passive devices on a common substrate.

Key Drivers for SAP Development

Exploration of the key drivers like miniaturization and the need for higher performance that led to the development of SAP technology.

Integration and Performance Benefits of SAP

Explanation of how SAP enhances integration of different chips and improves performance through features like flip chips and digital RF integration.

Applications and Future Trends of SAP

Overview of the diverse applications of SAP technology in various industries and insights into the future trends like 2.5D and 3D integration.

Security Concerns and Preventive Measures in SAP

Discussion on potential security risks in SAP technology and the importance of implementing protective measures like firewalls and encryption.

Challenges and Advantages of SAP

Analysis of the challenges like lower yield and design complexities, as well as the advantages such as high-frequency device support and small form factor in SAP technology.

Conclusion and Evolution of SAP

Recap of the evolution of SAP technology from integrating different chips to chiplets and its current status as a system with integrated memory and logic.

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