Summary
The video introduces wafer level packaging, emphasizing performance improvement, cost reduction, and higher yield as key advantages. It discusses processes like lithography and wafer building while addressing challenges such as thermal fatigue and CTE mismatch. The application areas for wafer level packaging including MEMS, sensors, and power management are explored along with a comparison to panel level packaging. The future prospects for wafer level packaging are optimistic, showcasing ongoing development and investment in this technology.
Introduction to Wafer Level Packaging
This chapter introduces wafer level packaging and highlights its advantages such as performance improvement, cost reduction, and higher yield.
Wafer Level Packaging Process
The process of wafer level packaging is discussed, including lithography, wafer building, and more.
Challenges in Wafer Level Packaging
This chapter covers the challenges faced in wafer level packaging, such as thermal fatigue, CTE mismatch, and production issues.
Applications of Wafer Level Packaging
Various applications of wafer level packaging in MEMS, sensors, power management, and more are explored.
Comparison with Panel Level Packaging
A comparison between wafer level packaging and panel level packaging is made, discussing the differences in technology and challenges.
Future of Wafer Level Packaging
The future prospects of wafer level packaging are discussed, highlighting the ongoing development and investment in the technology.
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