Packaging Part 3 - Silicon Interposer

Introduction to the concept of an interposer, focusing on the silicon interposer as a substrate that connects and provides vertical and horizontal connections between dies, offering denser and more efficient interconnections compared to traditional wire bonds.

Explanation of the functionality of a silicon interposer, detailing its role in providing connections between dies and connecting inputs and outputs vertically and horizontally, enabling higher density and efficiency in interconnections.

Comparison between active and passive interposers, highlighting the differences in function and design, with active interposers having embedded components like sensors and clocks, and passive interposers serving simple interconnection purposes.

Overview of the main suppliers of interposers, with TSMC being a primary supplier and other foundries entering the market, indicating a growing market for interposers in the future.

Explanation of the necessity of a silicon interposer in modern chip design, emphasizing the demand for higher interconnection density and space efficiency, driving the resurgence of interposer technology in packaging.

Detailed description of the components of an interposer, including through-silicon vias (TSVs), redistribution layers, under-bump metallization (UBM), and solder bumps, illustrating their functions in providing vertical and horizontal connections within the interposer.

Exploration of through-silicon via (TSV) technology, highlighting the vertical pathways in interposers that enable high-density interconnections, with details on the fabrication process and considerations such as aspect ratio and filling techniques.

Explanation of the redistribution layer (RDL) and under-bump metallization (UBM) in interposers, showcasing their roles in rerouting interconnections and providing mechanical support and interconnections between different components.

Insight into the supply chain of interposers, discussing the involvement of foundries and IDM companies in different processes such as backside bump debonding and shipping, with a breakdown of which companies handle specific steps in interposer production.

Recap of key points discussed in the video, including the benefits of interposers in chip design, the types of interposers available, the role of active components, and considerations in interposer design and supply chain.