Summary
This video provides a comprehensive overview of the semiconductor supply chain, from the creation of silicon wafers to packaging and design. It discusses the roles of semiconductor manufacturers, foundries, fab-less companies, OSAT companies, and IDMs in the chip production process. The evolution from single-die chips to System-on-Chip (SoC) and Multi-Chip Module (MCM) designs is explored to enhance functionality and simplify design. Additionally, the video introduces System-in-Package (SiP) technology for improved performance and compact design, as well as System-on-Package (SoP) technology with embedded passive components for advanced design capabilities.
Introduction to IC Packaging
Overview of the supply chain for IC packages and the types of chips used in the process.
Semiconductor Manufacturers and Silicon Wafers
Explanation of how semiconductor manufacturers create silicon wafers used for printing chips with photosensitive layers.
Global Foundries and UMC
Discussion of global foundries like Global Foundries and UMC that focus on chip manufacturing only.
Fabulous Companies
Explanation of fabulous companies' focus on chip designing and marketing, using examples like NVIDIA and Qualcomm.
OSAT Companies
Overview of OSAT companies that provide packaging services for chips and the challenges they face in the supply chain.
IDMs (Integrated Device Manufacturers)
Explanation of IDMs who design, package, and sell chips independently, emphasizing their significant role in the industry.
Evolution to System on Chip (SoC) and Multi-Chip Module (MCM)
Transition from single-die chips to SoC and MCM chips to improve functionality and design simplicity.
System in Package (SiP)
Introduction to SiP technology, combining multiple chips horizontally and vertically for enhanced performance and compact design.
System on Package (SoP)
Explanation of SoP technology with embedded passive components in the package substrate, leading to advanced design capabilities.
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